THE DEVICE FOR RAPID OUTPUT INSPECTION OF CRYSTALLINE SEMICONDUCTORS
AND DIELECTRIC MATERIALS QUALITY
KPT

Destination


   Automatic detection and measuring of defects
on the surface of silicon wafers used in the manufacture
of heat-sensitive scales and stensils.

Functional possibilities


Automatic mode:

  • Scanning and input to the computer of the images of various sections of the plate
  • Inspection for defects and determining of their sizes
  • Mapping of the defect density in different parts of the plate and their statistical size distribution
  • Interactive mode:

  • input of images from the microscope
  • saving in files, visualization on the monitor and printing of images
  • obtaining numerical characteristics of the defects pointed by an operator (linear dimensions, area and shape)
  • Technical Characteristics


    Enlargement of the image on the camera

    2,5x, 10x , 20x , 40x

    The range of motion of the object (table) in the X and Y axis

    0 - 50 mm

    Table motion speed

    0.5 mm / s

    The minimum size of detected defects

    2 microns

    The maximum size of detected defects

    200 microns

    The error in determining the linear defect sizes ranging from 20
    microns to 200 microns

    20%,
    less than 20%

    Processing time per one image frame

    1 sec

    Image resolution

    756x581

    The number of brightness levels

    256

    The system can be used in industry and in science research.


    Russkaya, 41, Novosibirsk, Russia, 630058
    Director of Institute, Prof. Yu. V. Chugui.
    Tel. +7 (383) 306-58-95,306-62-08 Fax: +7 (383) 306-58-69
    e-mail: chugui@tdisie.nsc.ru
    http://www.tdisie.nsc.ru